The YDS-CMNL-IMX377 V3.0 camera module No Lens sensor board uses the Sony IMX377 high-quality CMOS sensor, with a diagonal of 7.81mm (1/2.3 type) CMOS image sensor, a pixel of 1.55um, a color square pixel display, an effective pixel of 12.35 megapixels, and a high-definition image.
When used with the master board, it can support shooting 12M pixel high-definition photos, up to 4K@60FPS (differential), 4K@30FPS video shooting, with the characteristics of true color restoration and excellent image quality. Connection to the master board either by directly plug or by coaxial cable for varies installation scenarios. The PCBA board reserves a gyroscope spacing, supporting multi-axis EIS anti-shake image stabilization function. The board frame size is 32x32mm.
This camera module is not sold separately. The camera module is solely compatible our company’s Ai Master board as they must be sold in bundle, optionally with WiFi expansion board or Network Ethernet board.
| Specifications |
|
| Model No. |
YDS-CMNL-IMX377 V3.0 |
| Image Sensor |
IMX377 |
| Image Sensor Type |
CMOS |
| Effective Pixels |
12.35 Megapixels |
| Sensor Size |
1/2.3" |
| Pixel Size |
1.55 um x 1.55 um |
| EIS Anti-Shake (Reserved) |
Supportive Electronic EIS Image Stabilization |
| Video Frame Rate |
4K@24/25/30/FPS, 4K@48/50/60FPS (Differential)
2.7K@24/25/30/48/50/60FPS
1440@24/25/30/48/50/60FPS
1080P@24/25/30/48/50/60/120FPS
720P@24/25/30/48/50/60/120/240FPS |
| Video Slow Motion |
OFF, 4K2X, 1080P4X, 720P8X |
Photo Resolution
(with Master Board) |
20MP (5200x3900) (Differential)
13MP (4160x3120) (Differential)
12MP (4000x3000)
10MP (3648x2736)
8MP (3264x2448)
5MP (2592x1944)
3MP (2048x1536)
2MP (1920x1080) |
| Operating Temperature |
-10°C to +60°C |
| Storage Temperature |
-20°C to +80°C |
| Humidity |
20% to 80% |
| PCB Dimensions |
32 x 32 mm |
| Module Size |
32 x 32 x 24.7 mm |
| PCB Screw Hole Spacing |
28 x 28 mm |
| PCB Screw Hole Diameter |
2 mm |
| Lens Mount Screw Diameter |
1.6 mm |